Qualcomm and BOE announced a strategic cooperation to develop innovative display products integrating Qualcomm 3D Sonic ultrasonic fingerprint sensors. The cooperation between Qualcomm and BOE will cover smartphones and 5G related technologies, and is expected to expand into the fields of XR (extended reality) and the Internet of Things, which will hopefully bring enhanced performance experiences to consumers.
Compared with the optical screen fingerprints currently popular in the market, the ultrasonic fingerprints are significantly more secure. Their fingerprint recognition is at the 3D level, which can identify the grooves on the surface of the fingerprint. . At the same time, ultrasonic recognition does not rely on optical recognition, so it can perform fingerprint recognition in some special environments, such as fingerprint recognition when wet hands are not affected.
Qualcomm has provided the latest 3D Sonic Max ultrasonic fingerprint recognition technology in the Snapdragon 865 mobile platform. This technology has a larger recognition area than the previous screen fingerprint technology, which is larger than the usual screen fingerprint recognition area.17 Times, almost half of the screen can be covered, which is more convenient in use. In terms of security, it provides simultaneous recognition of two fingers, making it more difficult to crack fingerprints.
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There is no doubt that Qualcomm's 3D ultrasonic fingerprint recognition technology has great prospects. This cooperation with BOE will accelerate the mass production of 3D ultrasonic fingerprints, thereby providing consumers with mature and easy-to-use under-screen fingerprint functions.
Qualcomm and BOE are both looking forward to cooperation, and have started to integrate value-added and differentiated functions in BOE's flexible OLED panels. The integration of Qualcomm 3D Sonic sensors in BOE's OLED screen products aims to provide a more concise and efficient solution that enables smartphone manufacturers to create differentiated products. The cooperation between the two parties will also reduce the material costs and R & D expenses of mobile phone manufacturers.
It is reported that BOE will provide its customers with screen products with integrated 3D Sonic fingerprint sensors in the near future. Commercial terminals equipped with this integrated solution are expected to be launched in the second half of 2020.
